Fedarant PCB – Top Layer
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Fedarant PCB – Bottom Layer
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01Highlights
- Fedarant IoT Gateway – Bottom Layer View
- Multi-radio PCB (Wi-Fi / BLE 5.0 / ZigBee)
- Compact form factor design
- High-density SMD placement
- Controlled impedance routing
- RF-optimised ground planes
02Project Overview
Bottom-layer view of the Fedarant IoT Micro Gateway PCB, showcasing the high-density SMD component placement and optimised ground plane strategy that supports simultaneous tri-radio operation across Wi-Fi, BLE 5.0, and ZigBee.
03Key Components
Qualcomm QCA4020 tri-radio SoCSkyworks Wi-Fi Front End ModuleMacronix 32 Mb NOR Flash MemoryCUI / Mornsun AC-DC power module
04Salient Features
- High-density bottom-side component placement.
- Optimised ground planes for tri-radio RF performance.
- Controlled impedance traces for high-speed signals.
- Thermal relief vias for efficient heat dissipation.
05Scope of Work
01PCB stack-up definition
02Component placement and routing
03RF ground plane optimisation
04DFM review and fabrication handoff
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