RF Front-End Module
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Fedarant PCB – Top Layer
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01Highlights
- Fedarant IoT Gateway – Top Layer View
- Multi-radio PCB (Wi-Fi / BLE 5.0 / ZigBee)
- Qualcomm QCA4020 SoC layout
- RF antenna keep-out zones
- 4-layer controlled impedance stackup
- Compact 48 mm × 42 mm footprint
02Project Overview
Top-layer view of the Fedarant IoT Micro Gateway PCB, highlighting the Qualcomm QCA4020 SoC placement, antenna keep-out zones, and the compact routing strategy that fits tri-radio connectivity into a 48 mm × 42 mm footprint.
03Key Components
Qualcomm QCA4020 tri-radio SoCSkyworks RF Power AmplifierSTMicro low-drop voltage regulatorsIntegrated antenna structures
04Salient Features
- Compact 48 mm × 42 mm PCB footprint.
- Dedicated RF keep-out zones for antenna performance.
- 4-layer controlled impedance stackup.
- Clean power and ground separation for noise immunity.
05Scope of Work
01Schematic entry and net-list validation
02PCB layout and top-layer component placement
03Antenna keep-out zone definition
04Signal integrity and EMC review
05PCB fabrication and assembly coordination
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