Industrial Automation Controller
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Stellar Main Board
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1 / 501Highlights
- High-density Multi-layer Main Board
- SFP+ Network Ports (Grandmaster / Backhaul / Auxiliary)
- GPS / RTC Precision Timing
- LOM (Lights Out Management) Module
- Hardware / Firmware Design and Development
- USB-C and Power Board Interface
02Project Overview
A high-density embedded main board designed for network timing and synchronisation applications. Built around the FEDERON 2600 platform, the board integrates multiple SFP+ network interfaces for Grandmaster, Backhaul, and Auxiliary channels alongside a GPS/RTC subsystem for precision time-keeping. A dedicated LOM (Lights Out Management) module enables remote board management, while the power board connector supports modular power delivery. The dense multi-layer design accommodates high-speed signal routing across hundreds of components in a compact footprint.
03Key Components
High-performance Application ProcessorSFP+ Transceiver Modules (Grandmaster, Backhaul, Auxiliary)GPS Receiver and RTC ModuleLOM (Lights Out Management) ControllerUSB-C Interface ControllerMulti-rail Power Management ICs
04Salient Features
- Multi-channel SFP+ network interfaces.
- GPS / RTC for precision timing and synchronisation.
- LOM module for remote management and monitoring.
- High-density multi-layer PCB design.
- Modular power board interconnect.
- USB-C interface for configuration and diagnostics.
- Compact footprint with high component density.
05Scope of Work
01System Architecture Design
02Schematics Entry
03PCB Layout Design (Multi-layer)
04PCB Fabrication and Assembly
05Firmware Development
06Board Bring-up and Testing
07Signal Integrity Analysis
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