High-Power RF Power Amplifier - 1 kW @ 13.56 MHz
Industrial plasma generators and RF heating systems operate at high power levels where PCB parasitics become critical.
Technical design considerations:
- High-current RF paths using wide copper geometries
- Thermal spreading copper planes
- Controlled RF current loops
- High-voltage isolation for power stages
- RF shielding between driver and output stage
Stackup considerations:
| Parameter | Design Approach |
|---|---|
| Copper thickness | 2-4 oz copper |
| Substrate | Low loss RF laminate |
| Ground strategy | Continuous RF ground plane |
| EMI control | Shielding walls and cavity isolation |
EMI mitigation is essential since high-power RF stages easily generate harmonics and conducted emissions.
See Case study


