Plastic Enclosure Design
Plastic Enclosure Design for Electronics
Plastic enclosures represent the most common housing choice for consumer electronics, industrial handheld devices, and cost-sensitive IoT products. Qmax Systems designs injection-molded plastic enclosures that balance structural integrity, thermal performance, EMI management, and tooling cost - with a clear path from concept to mass production.
Thermoplastics
Polycarbonate (PC), ABS, PC-ABS blends. Nylon PA6 / PA66 and glass-filled engineering variants for structural applications.
Specialist Grades
PTFE (Teflon) for chemical or dielectric applications. UV-stabilised, flame-retardant UL94-V0 compliant materials.

IoT / Security
Wi-Fi Security Device Enclosure
Low tooling cost, integrated EMI suppression geometry, antenna keep-out zones for maximum Wi-Fi throughput.
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Automotive
Handheld OBD2 Diagnostic Device
4G, Wi-Fi, LCD, battery. Workshop-grade drop resistance, ergonomic grip geometry, internal RF coordination.
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