Qualcomm WIFI 6 TriBand Router
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1 / 301Highlights
- Aerospace-grade PCB design
- High-speed digital interfaces (LVDS, SPI, I2C)
- 8-layer controlled impedance stackup
- High-density BGA packages
- 2312 total pin count
- Stringent reliability requirements
02Project Overview
Aerospace PCB featuring high-density BGAs, multiple high-speed interfaces, and controlled impedance routing for mission-critical applications.
03Key Components
135-pin BGA packagesHigh-speed signal routingControlled impedance tracesAerospace-grade componentsEMI/EMC shieldingThermal management system
04Salient Features
- 8-layer PCB with controlled impedance.
- Support for LVDS, SPI, and I2C protocols.
- High pin count (2312) for complex systems.
- Aerospace reliability standards compliance.
05Scope of Work
01High-speed Design
02Signal Integrity Analysis
03PCB Layout Design
04Impedance Tuning
05Testing and Validation
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